01. |
2007 |
Development of blue light LED epi wafers and chips completed |
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02. |
2007 |
Mass production and customer certificate of blue light LED products completed |
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03. |
2008 |
Development of green light LED epi wafers and chips completed |
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04. |
2008 |
Mass production and customer certificate of green light LED products completed |
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05. |
2008 |
Surface coarsening high power blue-green light chips developed successfully |
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06. |
2008 |
Technical development and prototype of FC-LED completed |
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07. |
2009 |
Development of red/yellow LED epi wafers and chips completed |
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08. |
2009 |
Mass production and customer certificate of red/yellow light LED products completed |
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09. |
2009 |
FC-LED high reflective ohmic contact layer technology established |
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10. |
2009 |
AC-12V blue light InGaN LED chips developed successfully |
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11. |
2009 |
Technical development of wafer bonding and laser lift-off completed |
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12. |
2010 |
Collaboration with ITRI with the completion of UV LED preliminary study |
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13. |
2010 |
Collaboration with NCHU with the completion of quadratic vertical LED chips preliminary development |
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14. |
2010 |
Development of HV 50V InGaN LED chips successfully |
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15. |
2010 |
Development and mass production of red-yellow light high power chips in combination with wafer technology completed |
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16. |
2011 |
Production of UV EPI and chips with wavelengths 380-400nm |
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17. |
2011 |
Production of IR EPI and chips with wavelengths 660-850nm |
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18. |
2011 |
Production of HV chips |
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19. |
2011 |
Technique Development in coating |
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20. |
2011 |
Technique Development in pattern sapphire substrate (PSS) |
