EPILEDS believes in self-independent R & D by itself. Our sources of core technology mainly come from the research projects and development results from the R & D staff on a long term basis. EPI LEDS also maintains close relation with downstream packaging houses. In recent years, EPILEDS has been ambitiously recruiting R & D personnel. In addition to the technical cooperation with ITRI, EPILEDS also collaborates with research institutes of Taiwanese universities.
The latest main R & D projects is to develop highly optical reflective film technology of high-power chips, FC-LED high reflective ohmic contact layer, AC-LED blue light InGaN LED chips, and to complete the technical development of wafer bonding and laser lift-off. With the rapid growth of LED TV backlight and LED solid state lighting, how to integrate chip, packaging, module and lighting fixture has become a very important task for the R & D department in a chip manufacturer.
The latest main R & D projects is to develop highly optical reflective film technology of high-power chips, FC-LED high reflective ohmic contact layer, AC-LED blue light InGaN LED chips, and to complete the technical development of wafer bonding and laser lift-off. With the rapid growth of LED TV backlight and LED solid state lighting, how to integrate chip, packaging, module and lighting fixture has become a very important task for the R & D department in a chip manufacturer.
Due to special needs from downstream packaging plants, EPILEDS also develops unique chips for our customers, such as eutectic bonding LED chips and wafer-level phosphor coating LED chips. Meanwhile, with the diversified development of applications, EPI LEDS also actively engages in the R & D of AC LED chips and high voltage chips.
